DSAUD0010777.pdf

Manufacturer Laird Technologies
Partial File Text TflexTM 700 Series Thermal Gap Filler Innovative Technology for a Connected World HIGH THERMAL CONDUCTIVITY COMPLIANT GAP FILLER TflexTM 700 is a 5 W/mK soft gap filler thermal interface ma
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

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