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    DSAZSAA00019801.pdf

    • NXP Semiconductors
    • Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT634A D A F 3 D1 U1 B q C c 1 L p U2 E1 E w1 M A M B M A 2 L Q w2
    • Original
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    DSAZSAA00019801.pdf preview Download Datasheet

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