The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAFRAZ0015624.pdf
Manufacturer
National Semiconductor
Partial File Text
Packaging/CSP Wireless: Product Overview Page 1 August 1998 Substrate CSP Top View · 68% Board Area Reduction (vs. TSSOP 20) Only 25% larger than die · Standard SMT Process · JEDE
Datasheet Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSAFRAZ0015624.pdf preview
Download Datasheet
User Tagged Keywords
CSP28
LMX2324
LMX2330L
LMX2330LSLBX
PCB design for csp package
PSR-4000-AUS5
PSR4000-AUS5
TSSOP 16l Package