DSAZSAA00020289.pdf
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NXP Semiconductors
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Reflow soldering footprint
Footprint information for reflow soldering of DFN1212-6 package
SOT1229
1.5
1.3
0.15
0.35
(6x)
0.15
0.3
0.25 (6x)
0.4
0.15
1.4 1.05
0.2 (6x)
0
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Original
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Part pricing, stock, data attributes from Findchips.com
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