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    DSAZSAA00019055.pdf

    • NXP Semiconductors
    • Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P
    • Original
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    DSAZSAA00019055.pdf preview Download Datasheet

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