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    DSASW00220554.pdf

    • KOA Speer Electronics
    • NETWORKS Hybrid IC MULTI CHIP MODULE ยท SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder Ball Solder Ball Bare Chip Bare Chip Substrate Substrate S
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    DSASW00220554.pdf preview Download Datasheet

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    distance ring FR4 0.8mm thickness FR4 height thickness substrate fr4 substrate FR4 substrate height and thickness FR4 substrate height and thickness 1.2 ltcc chip

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