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    DSAZSAA00019006.pdf

    • NXP Semiconductors
    • Package outline Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT445B D A F 3 D1 D2 U1 B q C c 1 H U2 E2 E1 w1 M A M B M p A E
    • Original
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    DSAZSAA00019006.pdf preview Download Datasheet

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