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    DSAZSAA00019783.pdf

    • NXP Semiconductors
    • Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 5 leads SOT353 4.9 2.25 1.5 1 0.85 2.5 4.5 0.85 1 1.5 1.3 1.3 1.225
    • Original
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    DSAZSAA00019783.pdf preview Download Datasheet

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