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    DSAZSAA00020037.pdf

    • NXP Semiconductors
    • Package outline HVQFN40R: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; resin based; body 5 x 5 x 0.8 mm B D SOT945-1 A terminal 1 index area E
    • Original
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    DSAZSAA00020037.pdf preview Download Datasheet

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