DSASW00416677.pdf

Manufacturer White Electronic Designs
Partial File Text W332M64V-XSBX Application Note W332M64V-XSBX PACKAGE CONSTRUCTION + QUALIFICATION ENCAPSULANT TEST Thickness around die = 0.015 to 0.020 typical The encapsulant is not injection molded to co
Type Original
ECAD Model
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DSASW00416677.pdf preview Download Datasheet