DSAUTAZ0016086.pdf

Manufacturer STMicroelectronics
Partial File Text ® Thermal Data POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.6 W/cm°C 0.5 W/cm°C leadframe die attach copper soft solder (tin / l
Datasheet Type Original
ECAD Model
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