DSA2IH0044337.pdf

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Partial File Text DENSE-PAC ,A s .v MICROSYSTEMS J D E S C R IP T IO N : The D P Z 256X 16ln3 "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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ECAD Model

DSA2IH0044337.pdf preview Download Datasheet