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DSA0072912.pdf
Manufacturer
Enpirion
Partial File Text
Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion's power converter packages utilize module package technology to form Land Gr
Type
Original
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User Tagged Keywords
AN103
an103r
Enpirion
lga components
LGA land pattern
LGA PACKAGE thermal resistance
paste profile
reflow profile FOR LGA COMPONENTS
solder joint
stencil
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