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DSASW00211548.pdf
Manufacturer
Infineon Technologies
Partial File Text
T-M4.9 Wire Bond Globe Top Package For contact based application (Controller) Short Product Overview May 2010 Chip Card & Security T-M4.9 T-M4.9 Short Product Overview Ref.: Chip_
Type
Original
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User Tagged Keywords
iso 10373-1
iso 7810
iso iec 7810