The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSASW00415953.pdf
Manufacturer
VTI Technologies
Partial File Text
14 Nov 2006 1 (3) WHAT IS AHEAD IN THE PACKAGING ROADMAP OF MEMS? Packaging of ICs goes wafer level and 3D Wafer level packaging, WLP, and 3D-packaging are the major trends in packaging of se
Datasheet Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSASW00415953.pdf preview
Download Datasheet
User Tagged Keywords
MEMS and IC advantage
mems integrated sensor pressure
MEMS pressure sensor
mems sensor
mems sensor cost
wafer sensors