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    SG-BGA-6093 datasheet

    • Ironwood Electronics
    • GHz BGA Sockets-0.8mm; IC Size X (mm): 19; IC Size Y (mm): 19; IC Array X: 22; IC Array Y: 22; Max Pincount: 484; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.33; Max Package Code: BGA484; Backing Plate: no; Cavity Down: Flat; Heat Sink: no; IC Top Surface: Swivel; Socket Lid: no; Part Description: GHz BGA Socket (ZIF)
    • Original
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    SG-BGA-6093 datasheet preview Download Datasheet

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