DSADA0023177.pdf

Manufacturer Philips Semiconductors
Partial File Text PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSADA0023177.pdf preview Download Datasheet