DSAH00111052.pdf

Manufacturer Bourns
Partial File Text Lead Free Solder Reflow Profile SMD Trimmers Process Description 1. Apply solder paste to test board (8 - 10 mil thick) Materials · Sn Ag Cu Alloy water soluble or no clean solder paste1 · Single s
Type Original
ECAD Model
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DSAH00111052.pdf preview Download Datasheet