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    DSADA0023180.pdf

    • Philips Semiconductors
    • PDF: 2001 Dec 13 Philips Semiconductors Package outline HBGA388: plastic thermal enhanced ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink SOT636-1 B D A D
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    DSADA0023180.pdf preview Download Datasheet

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    MS-034 SOT636-1

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