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DSA0037400.pdf
Manufacturer
Mitsubishi
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MITSUBISHI INTEGRATED CIRCUIT PACKAGES SURFACE MOUNTING PROCESS 2.5 SOLDERING PROCESS There are two soldering methods used in surface mounting: the flow method and reflow method. This section out
Datasheet Type
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ECAD Model
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MITSUBISHI INTEGRATED CIRCUIT PACKAGES
MITSUBISHI INTEGRATED CIRCUIT PACKAGES reflow
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