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    DSASW00374190.pdf

    • STMicroelectronics
    • TN0193 Technical note LRIS64K bumped die description Product information Product name: LRIS64K Wafer and die features Wafer diameter: 8 inches Wafer thickness: 180 µm Die id
    • Original
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    DSASW00374190.pdf preview Download Datasheet

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