Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00299924.pdf

    • Central Semiconductor
    • PROCESS CP230 Power Transistor NPN - Silicon Darlington Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 80 MILS Die Thickness 8 MILS Base Bonding Pad
    • Original
    • Price & Stock Powered by Findchips

    DSA00299924.pdf preview Download Datasheet

    User Tagged Keywords

    "Darlington Transistor" CJD122 CP230 CZT122

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel