The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAE0072925.pdf
Manufacturer
Intel
Partial File Text
CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT (Surface Mount T
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSAE0072925.pdf preview
Download Datasheet
User Tagged Keywords
28F010
80486 DX4
80C196KB
80c196kb 1988
82425EX
DRS-21
intel 80486
IPC-SM-786
land pattern for TSOP
land pattern for TSOP 2
pace craft 100
paste profile
pcb warpage* in smt reflow
PQFP moisture sensitive handling and packaging
QFP PACKAGE thermal resistance
reflow profile
TSOP infrared
Price & Stock Powered by
Findchips