DSAEDA00057479.pdf

Manufacturer RF Micro Devices
Partial File Text RF6650 POWER MANAGEMENT IC Package: 8-Bump WLCSP, 3x3 Array, 1.58mm x1.57mm VANA Features ï® ï® ï® ï® ï® ï® ï® ï® ï® A1 RF6650 AGND High Efficiency >95% Tran
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAEDA00057479.pdf preview Download Datasheet