DSAZSAA00019056.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad si
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00019056.pdf preview Download Datasheet