Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00296033.pdf

    • Fairchild Semiconductor
    • www.fairchildsemi.com Application Note 7006 Guidelines for Using Fairchild's SO-8 FLMP Dennis Lang, Applications Engineer Introduction Board Layout The Flip chip in Leaded Molded Package
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00296033.pdf preview Download Datasheet

    User Tagged Keywords

    defect analysis to-220 FDS7066N3 FDS7066N7 IPC-7525 IPC-9502 IPC7525 IPC9502 J-STD-020B Lead Free reflow soldering profile BGA Solder paste stencil life
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel