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    DSAZSAA00019719.pdf

    • NXP Semiconductors
    • Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618 -2 B D D1 A terminal 1 index area A A4 E1
    • Original
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    DSAZSAA00019719.pdf preview Download Datasheet

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