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    DSAQ00374130.pdf

    • t-Global Technology
    • H48-2K Thermal Conductive Pad Features No carrier Low contact thermal impedance Non-Oil Blead High dielectric breakdown voltage Applications Electronic components: IC / CPU / MOS LED / M/B / P/S
    • Original
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    DSAQ00374130.pdf preview Download Datasheet

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    ASTM D2240 ASTM D412 ASTM D5470 D2240
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