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ScansUX2809.pdf
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DS2009 DALLAS SEMICONDUCTOR DS2009 512x9 FIFO Chip FEATURES « ⢠First-in, first-out memory-based architecture ⢠Flexible 512x9 organization ⢠Low-power HCMOS technology ⢠Asynchronous and sim
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ECAD Model
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DS2009
DS2009-120
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