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    DSAZSAA00020314.pdf

    • NXP Semiconductors
    • Thermal RC network (Foster) SPICE thermal model Symbol Parameter Rth(j-mb) BUK6507-75C Conditions thermal resistance from junction to mounting base 1.013E-04 F Cth6 1.671E-
    • Original
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    DSAZSAA00020314.pdf preview Download Datasheet

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