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DSA00260168.pdf
Manufacturer
STATS ChipPAC
Partial File Text
FLGA-SD Fine Pitch Land Grid Array - Stacked Die · Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution · Available in 1.2mm (TFLGA), 1.
Type
Original
ECAD Model
Part Details
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DSA00260168.pdf preview
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User Tagged Keywords
AN 7823
techpoint
Unbiased HAST 130, 85 RH, 100 Hrs