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    DSA2IH00173555.pdf

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    • rzrj SGS-THOMSON [»©»[IILligretMOtgS DIE SIZE: METALLIZATION: Top Back BACKSIDE THICKNESS: DIETHICKNESS: PASSIVATION: BONDING PAD SIZE: Source Gate 7 7 x 7 7 mils Al A u /C r/N i/A u 6100 A 16 ± 2 m
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