DSA00371297.pdf

Manufacturer IXYS
Partial File Text T-6R11 Chip Set 6A Half-Bridge Driver Die Outline Notes: 1. Wafer Diameter: 300 mm 2. Width of all Scribe Streets: 100 µm 3. Die Thickness: 300 ± 30 µm 4. Die Size Tolerance: ± 50 µm 5. Top Bonding
Type Original
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DSA00371297.pdf preview Download Datasheet