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    DSAZSAA00019033.pdf

    • NXP Semiconductors
    • Package outline TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm SOT487-1 E D A X c y HE v M A Z 17 32 A2 (
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    DSAZSAA00019033.pdf preview Download Datasheet

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