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    DSA00282304.pdf

    • Mitsubishi
    • 2.12 2nd Generation DIP and Mini-DIP-IPM Features: · Ultra Compact Transfer Mold Package · Including Drive and Protection ICs (low and high voltage drive ICs) · Low and High Speed Types · All
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA00282304.pdf preview Download Datasheet

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