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    DSA0059859.pdf

    • Wakefield Engineering
    • Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS Low-Profile Heat Sinks for All Metal-Case Power Semiconductors 621 AND 623 SERIES Footprint Dimensions in. (mm) 621A 6
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    DSA0059859.pdf preview Download Datasheet

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