DSADA0023175.pdf
-
Philips Semiconductors
-
PDF: 2003 Apr 07
Philips Semiconductors
Package outline
HTSSOP38: plastic thermal enhanced thin shrink small outline package;
38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
-
Original
-
-
Part pricing, stock, data attributes from Findchips.com
Findchips