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    DSA00367835.pdf

    • Allegro MicroSystems
    • APPLICATIONS INFORMATION HIGH-PERFORMANCE POWER PACKAGE FOR POWER-INTEGRATED CIRCUIT DEVICES ABSTRACT A new, high-performance version of a Plastic Dual-In-Line package with improved reliability
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    DSA00367835.pdf preview Download Datasheet

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    "leadframe material" DIP C151 C194 c151 lead frame c194 shear stress Copper Alloy C151 leadframe materials

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