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    DASF0029997.pdf

    • Motorola
    • Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc... by Thomas Koschmieder and Michael Leoni Introduction Th
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    DASF0029997.pdf preview Download Datasheet

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    12x12mm BGA package thermal resistance LGA Application Notes LGA Application Notes motorola lga components LGA PACKAGE thermal resistance pitch 0.4mm BGA solder wire 0.3 mm X-RAY INSPECTION
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