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    DSA00260099.pdf

    • STATS ChipPAC
    • FBGA-SD Fine Pitch Ball Grid Array - Stacked Die · FBGA-SD: Laminate substrate based enabling 2 & 4 layers of routing flexibility · FBGA-T-SD: Single metal layer tape based substrate with dense r
    • Original
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    DSA00260099.pdf preview Download Datasheet

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