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ScansUX1700.pdf
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DALLAS SEMICONDUCTOR DS2009 512x9 FIFO Chip FEATURES ⢠First-in, first-out memory-based architecture ⢠Flexible 512 x 9 organization ⢠Low-power HCMOS technology ⢠Asynchronous and simultaneou
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ECAD Model
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DS2009
DS2009-35
DS2009-50
DS2009-65
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DS2013