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DSA00290909.pdf
Manufacturer
Allegro MicroSystems
Partial File Text
Application Note AN26020 APPLICATIONS INFORMATION PROCEDURE FOR MEASURING PAD-TO-AMBIENT THERMAL RESISTANCE (RPA) FOR EXPOSED PAD PACKAGES SCOPE For devices with an exposed die pad, the di
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
5SC-TT-K-30-36
AN26020
TTK thermocouple