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    DSA00898306.pdf

    • Aeroflex
    • Standard Products UT6325 RadHard Eclipse FPGA Data Sheet December 2007 www.aeroflex.com/RadHardFPGA FEATURES 0.25m, five-layer metal, ViaLink epitaxial CMOS process for smallest die sizes One
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    • Part pricing, stock, data attributes from Findchips.com

    DSA00898306.pdf preview Download Datasheet

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