DSAZSAA00011528.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline Hi5 WLCSP6: wafer level chip-size package; 6 bumps; 0.77 x 1.17 x 0.515 mm B A D ball A1 index area A2 A A1 E detail X C e Ãv Ãw b y C A B C
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00011528.pdf preview Download Datasheet