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    DSA00100947.pdf

    • ON Semiconductor
    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS MICRO­8 LEADLESS CASE 846C­01 ISSUE O DATE 03/29/2002 1 SCALE 4:1 ­T­ W Y A M PIN 1 I.D. 2 PL 0.15 T J AA ÏÏÏÏ ÏÏÏÏ ÏÏÏ
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