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DSAH00473790.pdf
Manufacturer
Philips Semiconductors
Partial File Text
INTEGRATED CIRCUITS SL1 ICS31 01 Bumped I·CODE1 Label IC (97pF) (IC with Bumps) Chip Specification Product Specification Revision 1.2 Public July 2000 Philips Semiconductors Product Speci
Datasheet Type
Original
ECAD Model
Part Details
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ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE
snw-fq-627