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    DSASW00135460.pdf

    • Central Semiconductor
    • PROCESS CPZ19 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.7 x 17.7 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 11
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASW00135460.pdf preview Download Datasheet

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    CMPZ5235B CMPZ5261B CPZ19 Diode c 642 Zener diode zener diode chip zener wafer
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