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DSAZSAA00019087.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e â v â w b
Datasheet Type
Original
ECAD Model
Part Details
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