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    DSA0025168.pdf

    • Fujitsu
    • LEADLESS CHIP CARRIER 36 PAD CERAMIC LCC-36C-F01 EIAJ code : WQFN036-G-S550-1 Lead pitch 50mil Package width × package length 550 × 550mil Sealing method 36-pad ceramic LCC Fr
    • Original
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    DSA0025168.pdf preview Download Datasheet

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    c3600 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN036-G-S550-1

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