DSAHI00025119.pdf

Manufacturer Not Available
Partial File Text ! 220 hxeii l a v o u i C o n n e c t o t s *2jnm pitch. to · Available with low frequency, high frequency and high power contacts. · Integral jacking mechanism. I footprint for ised packaging
Type Scan
ECAD Model

DSAHI00025119.pdf preview Download Datasheet